AMD 首次公开 Helios 的 TH6 scale up 交换芯片设计,可见其依赖 Broadcom 的以太网 retimer 和 scale up 交换芯片。这暴露了 AMD 缺乏完整硅产品组合,scale up 机架所需的交换芯片需外购。retimer 还会增加 scale up 路径延迟,未来 AMD 将与 UALink 交换芯片厂商合作。
AMD Helios (partial co-design): AMD revealed the TH6 scale up switch design publicly for the first time. If you look close enough, you can spot all the Broadcom ethernet retimers next to the flyover cables coming from the backplane into the switch ASIC. This design demonstrates AMD's lack of complete silicon product portfolio, particularly a scale up switch, which is necessary for a scale up rack. In the case of Helios, AMD relies on Broadcom for the scale up switch and retimers alone the scale up path. In the future, AMD are also working with UALink switch vendors in their pursuit of a true UALink scale up system. https://www.broadcom.com/products/ethernet-connectivity/phy-and-poe/optical/bcm83361.
In our advancing AI 2026 article, we talked about the challenges with these retimers and flyover cables towards manufacturing and signal performance. The retimers also add extra latency alone the scale up path. https://open.substack.com/pub/semianalysis/p/can-amd-break-the-cuda-moat-amd-advancing?r=2tvhp5&selection=49db110a-6f59-4bae-91a7-2492a088fac3&utm_campaign=post-share-selection&utm_medium=web&aspectRatio=instagram&textColor=%23ffffff&bgImage=true
POV: You’re an engineer building AMD Helios. Next up: putting it to the test. Episode 2 drops today 👀在 X 查看被引用的帖子
来源:SemiAnalysis · x.com