壁仞科技(Biren)再启配股融资 募资 5.15 亿美元
AI Chipmaker Biren Taps Market Again in $515 Million Share Sale
壁仞科技(Biren)拟以每股 31.08 港元配售 1.3 亿股新股,募资 4.04 亿港元(约 5.15 亿美元),用于支持其 AI 布局。该配售价较周三收盘价折让近 10%,此番再融资延续了中国 AI 公司的密集募资潮。
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AI Chipmaker Biren Taps Market Again in $515 Million Share Sale
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By Sangmi Cha and Dong Cao
October 8, 2026 at 2:46 AM UTC
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Shanghai Biren Technology Co. aims to raise HK$4.04 billion ($515 million) in another share sale to help bankroll its artificial intelligence ambitions, adding to the fundraising spree from Chinese AI companies.
Biren, one of a group of graphics processing unit developers championed by Beijing, is placing 130 million new shares at HK$31.08 apiece, according to a Hong Kong stock exchange filing. That represents a nearly 10% discount to Wednesday’s close.
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来源:Bloomberg:Technology · bloomberg.com