Cerebras 联合创始人兼 CEO Andrew Feldman 指出，AI 加速器行业普遍面临 HBM 内存、CoWoS 封装产能和台积电 3nm 制造三大供应链瓶颈。Cerebras 凭借架构选择基本绕开这三者：不依赖 HBM 和 CoWoS，当前芯片采用 5nm 而非 3nm 工艺。在内存、先进封装和前沿制程产能直接制约出货的行业环境下，这使其供应格局与主流 GPU 系统显著不同。
Andrew Feldman, co-founder and CEO of Cerebras explains the 3 major supply-chain bottlenecks affecting much of the AI accelerator industry:
HBM memory, CoWoS packaging capacity, and access to TSMC’s 3nm manufacturing. Cerebras largely sidesteps all 3 by architectural choice.
It does not rely on HBM or CoWoS, and its current chips are manufactured on a 5nm process rather than 3nm.
In an industry where access to memory, advanced packaging, and leading-edge fabrication capacity can directly constrain shipments, that gives Cerebras a materially different supply profile from the main-street GPU systems.
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full video on The MAD Podcast with Matt Turck and Cerebras YouTube channel, (link in comment)
来源：Rohan Paul · x.com